Silicon Wafers Laser Micromachining – Potomac Photonics has extensive experience laser cutting micro feature in silicon wafers. High speed cutting and drilling of silicon wafers can be accomplished with extremely sharp edges and minimal dross and burrs.
Laser cutting of silicon wafers is possible in all sizes and thicknesses with feature sizes as small as 20 microns. In addition, complex features such as channels and pockets and channels can be machined in silicon wafers. All that is required is a drawing to getting started.
Check out our gallery to see a large variety of micro machined parts: https://www.potomac-laser.com/project-gallery/