Micro-Hole drilling for probe card applications is achievable in a variety of materials such as Silicon Nitride, Polyimide, Ultem and others.
Micro-Holes as small as 2 microns can be laser drilled with very tight positional tolerances over large areas. Depending on the desired thickness of the material, controlled tapered micro-holes can be drilled to exact specification. Larger holes for assembly and orientation can also be drilled utilizing the same technology used for the micro-holes.
Micro Laser Drilling is the preferred method for probe card drilling as it offers several advantages:
Versatile – lasers can create various hole shapes including circular, square, conical and rectangular
Precise – control is the greatest advantage with lasers
Consistent – programmable and non wearing
Speed – manufacturing demands are swift as are lasers
Quality – the pulsed lasers are ultrashort which reduces thermal impact while increasing quality.
