Potomac Photonics has a broad range of technologies and processes to micromachine almost any type of polymer material on the market with features both small (down to a micron) and large. Our goal is to be your one stop shop for custom plastic parts and materials.
Ceramic and PZT
Various types of ceramic and crystalline substrates can be processed, including alumina, silicon nitride, silicon, diamond, and sapphire. In many cases, laser processes like those used by Potomac are the only viable approach to precision machining of these difficult materials.
Silicon Wafers Laser Micromachining
High speed cutting and drilling of silicon wafers can be accomplished with extremely sharp edges and minimal dross and burrs. Laser cutting of silicon wafers is possible in all sizes and thicknesses with feature sizes as small as 20 microns.
Potomac has a broad range of tools that are capable of machining extremely precise features in almost any type of metal material. Utilizing cutting edge laser and micro-CNC technology, we can fabricate features as small as 1 micron.
Utilizing high accuracy motion systems, Potomac is capable of holding very tight positional tolerances across very large parts. Line widths can be as narrow as 10 microns depending on the type of glass.