Wafer Dicing with Laser Micromachining Creates Unique Chip Shapes in Silicon
Potomac Photonics is proud to help our neighbors at bwtech@UMBC Wafer dicing has been used for decades in the semiconductor industry to separate the individual die, or integrated circuits, from the large wafers on which they are manufactured. Often the wafer is scribed and then mechanically broken apart or sawed with special tools. However, laser…