Silicon Wafer Dicing and Resizing
Potomac is the leader in silicon wafer dicing and resizing. With very tight tolerances and clean edges, our systems can cut or drill holes quickly and cost-effectively. We can also laser mark IDs on resized wafers and cut flats and notches. We use high precision stages and video registration to align to specific features or fiducial marks. Call or Email us to today to discuss your application.