Filling is a term we use to reflect additive processing as opposed to subtractive processing (milling). We have developed two advanced technologies for additively processing materials; Contact Transfer and Mill&Fill. Both are laser based manufacturing methodologies.

With Contact Transfer, we utilize laser light to transfer material from a carrier ribbon onto the component. This process is capable of directly writing a variety of materials including conductors, resistors and insulators.

With Mill&Fill, we utilize laser light to pattern grooves in the component which can then be filled with a particular material; typically a conductive ink.