Ceramic and PZT

Laser Micromachining of Ceramic

Laser Micromachining of Ceramic

Various types of ceramic and crystalline substrates can be processed, including alumina, silicon nitride, silicon, diamond, and sapphire.   In many cases, laser processes like those used by Potomac are the only viable approach to precision machining of these difficult materials.  Feature sizes, depending upon thickness of the substrate, can be as small as 25µ with excellent edge quality, minimal microcracking and no heat affected zone.

In many cases, Potomac is capable of laser machining  through-holes, blind holes, channels, slots, and other geometries in both flat and 3D substrate configurations.

Custom Ceramic Parts for the Medical, Biotech, Automotive and Electronics Industries

Applications include, Probe Cards, Fiber Guides, Microfluidics and more.

All that is required to get started is a drawing of your part.

Microfluidic Channel in Ceramic

Microfluidic Channel in Ceramic

Some of the ceramic materials that Potomac can micromachine include:

ALUMINA
Alumina is the most widely used ceramic material. It offers excellent performance in terms of wear resistance, corrosion resistance and strength at a reasonable price. Its high dielectric properties are beneficial in electronic products.

SILICON NITRIDE
Silicon nitride offers an excellent combination of low density, high strength, low thermal expansion and good corrosion resistance and fracture toughness.

SILICON CARBIDE
Silicon carbide has the highest corrosion resistance of all the advanced ceramic materials. It also retains its strength at temperatures as high as 1400°C.
ZIRCONIA
Zirconia has the highest strength and toughness at room temperature of all the advanced ceramic materials. The fine grain size allows for extremely smooth surfaces and sharp edges.

SAPPHIRE
Single crystal sapphire offers superior mechanical properties and chemical stability coupled with light transmission.