Silicon Wafer Cutting
Potomac Photonics has extensive experience laser cutting complex feature in silicon wafers. High speed cutting and drilling of silicon wafers can be accomplished with extremely sharp edges and minimal dross and burrs.
Laser cutting of silicon wafers is possible in all sizes and thicknesses with feature sizes as small as 20 microns.
Potomac can also perform high speed drilling of small holes in silicon wafers. All that is required is a drawing to getting started.