Custom Ceramic Parts

Laser drilled hole in ceramic (Alumina)

Various types of ceramic and crystalline substrates can be processed, including alumina, silicon nitride, silicon, diamond, and sapphire.   In many cases, laser processes like those used by Potomac are the only viable approach to precision machining of these difficult materials.  Feature sizes, depending upon thickness of the substrate, can be as small as 25µ.

In many cases, Potomac is capable of laser machining  through-holes, blind holes, channels, slots, and other geometries in both flat and 3D substrate configurations.

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